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V. Carolina Ayala, Michalzik, M. , Harling, S. , Menzel, H. , Guarnieri, F. A. , und Büttgenbach, S. , Design, construction and testing of a monolithic pH-sensitive hydrogel-valve for biochemical and medical application, Journal of Physics: Conference Series, Bd. 90, S. 012025, 2007.
W. Augustin, Bode, K. , Lucas, N. , Büttgenbach, S. , und Scholl, S. , Influence of microstructures on convective heat transfer under laminar and turbulent flow conditions, in Proc. 2nd International Conference on Transport Phenomena in Micro- and Nanodevices, 2006.
W. Augustin, Bode, K. , Scholl, S. , Lucas, N. , und Büttgenbach, S. , Influence of microstructures on convective heat transfer under laminar and turbulent flow conditions, Nanoscale and Microscale Thermophysical Engineering, Bd. 11, S. 43 55, 2007.
U. Arz, Rohland, M. , Kuhlmann, K. , und Büttgenbach, S. , Broadband 110 GHz on-wafer interconnects built in CMOS-compatible membrane technology, in Proc. of the 25th Asia-Pacific Microwave Conference, 2011, S. 1110 1113.
U. Arz, Rohland, M. , Kuhlmann, K. , und Büttgenbach, S. , Wideband electromagnetic modeling of coplanar waveguides fabricated in membrane technology, in Proc. 15th Workshop on Signal Propagation on Interconnects, 2011, S. 129 130.
U. Arz, Rohland, M. , Kuhlmann, K. , und Büttgenbach, S. , Broadband performance of 110 GHz interconnects built in HRSi-based membrane technology, in Proc. IEEE 16th Workshop on Signal and Power Integraty, 2012, S. 3 6.
U. Arz, Rohland, M. , und Büttgenbach, S. , Improving the performance of 110 GHz membrane-based interconnects on silicon: Modeling, measurements, and uncertainty analysis, IEEE Transactions on Components, Packaging and Manufacturing Technology, Bd. 3, S. 1938–1945, 2013.
U. Arz, Rohland, M. , Kuhlmann, K. , und Büttgenbach, S. , Optimized coplanar waveguides in membrane technology for wideband on-wafer calibrations, in Proc. 20th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), 2011, S. 77 80.
U. Arz, Rohland, M. , und Büttgenbach, S. , Improving on-wafer measurements with membrane-technology-based calibration standards, in Proc. 76th ARFTG Microwave Measurement Conference, 2010, S. 44 50.
G. Arutinov, Quintero, A. V. , Smits, E. C. P. , van Remoortere, B. , Van Den Brand, J. , Schoo, H. F. M. , Briand, D. , de Rooij, N. F. , und Dietzel, A. , Capillary self-alignment dynamics for r2r manufacturing of mesoscopic system-in-foil devices, 2012 4th Electronic System-Integration Technology Conference, ESTC 2012, 2012.
G. Arutinov, Mastrangeli, M. , Smits, E. C. P. , Schoo, H. Franciscus, Brugger, J. , und Dietzel, A. , Dynamics of capillary self-alignment for mesoscopic foil devices, Applied Physics Letters, Bd. 102, 2013.
G. Arutinov, Mastrangeli, M. , van Heck, G. , Lambert, P. , Toonder, J. M. J. Den, Dietzel, A. , und Smits, E. C. P. , Capillary Gripping and Self-Alignment: A Route Toward Autonomous Heterogeneous Assembly, IEEE Transactions on Robotics, Bd. 31, S. 1033–1043, 2015.
G. Arutinov, Smits, E. C. P. , Mastrangeli, M. , van Heck, G. , van den Brand, J. , Schoo, H. Franciscus, und Dietzel, A. , Capillary self-alignment of mesoscopic foil components for sensor-systems-in-foil, Journal of Micromechanics and Microengineering, Bd. 22, 2012.
G. Arutinov, Mastrangeli, M. , Smits, E. C. , van Heck, G. , Toonder, J. M. Den, und Dietzel, A. , Foil-to-foil system integration through capillary self-alignment directed by laser patterning, Journal of Microelectromechanical Systems, Bd. 24, S. 126–133, 2015.
G. Arutinov, Mastrangeli, M. , Smits, E. C. , Van Heck, G. , Schoo, H. F. , Toonder, J. J. Den, und Dietzel, A. , Shift dynamics of capillary self-alignment, IFIP Advances in Information and Communication Technology, Bd. 435, S. 61–68, 2014.
M. Alavi, Büttgenbach, S. , Schumacher, A. , und Wagner, H. - J. , Fabrication of microchannels by laser machining and anisotropic etching of silicon, Sensors and Actuators, Bd. A 32, S. 299 302, 1992.
M. Alavi und Büttgenbach, S. , Löten von Feindrähten auf Cu-Anschlussflächen mit Laserstrahl: Laser soldering of small diameter wires to copper circuit pads, Laser und Optoelektronik, Bd. 2, S. 52 54, 1988.
M. Alavi, Büttgenbach, S. , Schumacher, A. , und Wagner, H. - J. , Laser machining of silicon for fabrication of new microstructures, IEEE, S. 512 515, 1991.
M. Alavi, Lorenz, M. , und Büttgenbach, S. , Microstructure and composition of laser soldered joints: investigation of intermetallic layers by high sensitive surface analyses: DVS-Berichte. 1990.
M. Alavi, Lorenz, M. , und Büttgenbach, S. , Optical Emission during Laser Welding: Lichtemission während des Laserschweissprozesses, Laser und Optoelektronik, Bd. 21, S. 69–72, 1989.
M. Alavi, Büttgenbach, S. , Schumacher, A. , und Wagner, H. - J. , New microstructures in silicon using laser machining and anisotropic etching, in Proc. 2nd International Conference on Micro Electro, Opto, Mechanic Systems and Components, 1991, S. 322 324.
M. Alavi und Büttgenbach, S. , Laser Soldering of Small Diameter Wires to Copper Gircuit Pads: Löten von Feindrähten auf Cu-Anschlussflächen mit Laserstrahl, Laser und Optoelektronik, Bd. 2, S. 52–54, 1988.
M. Alavi, Büttgenbach, S. , und Schumacher, A. , Anwendung von Festkörperlasern in der Mikrotechnik, in Proc. 1st International Conference on Micro Electro, Opto, Mechanic Systems and Components, 1990, S. 242 252.
M. Alavi, Lorenz, M. , und Büttgenbach, S. , Lichtemission während des Laserschweissprozesses: Optical emission during laser welding, Laser und Optoelektronik, Bd. 21, S. 69 72, 1989.
M. Alavi, Büttgenbach, S. , und Schuhmacher, A. , Festkörperlaser lösen Mikroverbindungsprobleme, SMD-Magazin, Bd. 1, S. 70 72, 1991.

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